multilayer ceramic chip capacitors 1 of 3 creation date : july 03, 2017 (gmt) cga5l3x7r1h335m160ab tdk item description cga5l3x7r1h335mt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga5(3216) [eia 1206] status production size length(l) 3.20mm 0.20mm width(w) 1.60mm 0.20mm thickness(t) 1.60mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 3.3f 20% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 151m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : july 03, 2017 (gmt) cga5l3x7r1h335m160ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga5l3x7r1h335m160ab esr cga5l3x7r1h335m160ab capacitance cga5l3x7r1h335m160ab dc bias characteristic cga5l3x7r1h335m160ab temperature characteristic cga5l3x7r1h335m160ab(no bias) cga5l3x7r1h335m160ab(dc bias = 25v ) ripple temperature rising cga5l3x7r1h335m160ab(100khz) cga5l3x7r1h335m160ab(500khz) cga5l3x7r1h335m160ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : july 03, 2017 (gmt) cga5l3x7r1h335m160ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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